Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages
Ke, X., Jingshen, S.W., Haibin, C., Jingbo, G. & Angus, L., Warpage Prediction of Fine Pitch BGA by Finite Element Analysis and Shadow Moiré Technique, Proceedings of the 10th International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, Aug, 2009.
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Bendaou, Ot., Bourzeix, F., El Hami, A., Agouzoul, M. & El Bakkali, L., BGA Warpage Investigations by Measurement and Stochastic FEA, Proceedings of the 11th Moroccan Mechanics Congress, Agadir, Morocco, April, 2013.
JEDEC Standard, JESD22-B112, High Temperature Package Warpage Measurement Methodology, 2005.
Hassell, P., Measurement of Thermally Induced Warpage of BGA Packages/Substrates Using Phase-Stepping Shadow Moiré, Proceedings of the Electronic Packaging Technology Conference, Atlanta GA, USA, October, 1997.
Sun, W., Zhu, W.H. & Wang, C.K., Warpage Simulation and DOE Analysis with Application in Package-on-Package Development, Proceedings of the IEEE-EuroSim Conference, Freiburg im Breisgau, Germany, April, 2008.
JEDEC Standard, JESD22-B108A, Coplanarity Test for Surface-Mount Semiconductor Devices, 2003.
Patrick, B.H., Advanced Warpage Characterisation: Location and Type of Displacement Can be Equally as Important as Magnitude, Proceedings of the Pan Pacific Microelectronics Symposium Conference, Kauai-Hawaii, USA, February, 2001.
Bendaou, Ot., Rojas, J.E., El Hami, A., Aannaque, A. & Agouzoul, M., Stochastic and Reliability Analysis of a Propeller with Model Reduction, European Journal of Computational Mechanics, 18(2), pp. 195-215, 2009.
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