Experimental Study of an Aluminum-Polysilicon Thermopile for Implementation of Airflow Sensor on Silicon Chip
DOI:
https://doi.org/10.5614/itbj.eng.sci.2007.39.2.2Abstract
A multi-directional airflow sensor has been realized. The essential part of the considered sensor is a thermopile configuration, which enables the measurement of flow speed and flow direction. The thermopile is a series arrangement of eight thermocouples. A thermocouple converts a difference in temperature into an electrical signal, by means of the Seebeck effect . The thermocouples are made of aluminum-N-type polysilicon junctions. The incoming flow is heated and the degree of heat transfer by convection to the flow, depends on the speed of the flow; the faster the flow the smaller the heat transfer, which leads to a smaller (Seebeck) output voltage of the thermopiles. After signal conditioning - i.e., filtering and amplification by means of an amplification system - the electrical output signals of the thermopiles are further signal-processed by applying analog-to-digital signal conversion, so that finally the flow speed and the flow direction can be properly displayed on a computer screen. The measured values of the Seebeck coefficient or thermopower (S) were in the range of: 0.43 to 0.68 mV/K which are in good agreement with the values found in the literature: 0.5 to 0.7 mV/K. Moreover, it was found that the flow speed U is proportional to the reciprocal value of the square of the output voltage of the outgoing thermopile.
Downloads
References
Makinawa, K.A.A. & Huijsing, J.H., A Smart Wind-Sensor Using Time Multiplexed Thermal Delta Modulation, ESSCIRC, pp.460-463, 2001.
Oudheusen, B.W. van & Huijsing, J.H., An Electronic Wind Meter Based on a Silicon Flow Sensor, J. Sensors & Actuators, A21-23 p420-424, 1990.
Incropera, F.P. & DeWitt, D.P., Heat and mass transfer, 5th ed., J. Wiley & Sons, N.Y., 2005.
Smith, R.A., Semiconductors, 2nd ed., Cambridge University Press, 1978.
Nolas, G.S., Sharp, J. & Goldsmid, H.J., Thermoelectrics, Basic Principles and New Materials, Springer-Verlag, B. Heidelberg, 2001.
Chang Liu, et.al., A Micromachined Flow Stress Sensor based on Thermal Transfer Principle, J. Microelectromechanical Systems, Vol. 8, No. 1, 1999.
Okulan, Nikan, A Pulse Mode Micromachined Flow Sensor with Temperature Driff Compensation, IEEE Transction on Electron Device, 47(2), 2000.
Balters, Hendry, Proceeding of the IEEE, 86(8), 1998.
Oudheusden, B.W. van, Integrated Thermopile Sensors, J. Sensors and Actuators, A21-23, p. 621-630, 1989.