Rentang Modulus dari Thin Layer yang Menunjukkan Kondisi Bonding Antar Lapisan Beraspal

Authors

  • Eri Susanto Hariyadi Program Studi Teknik Sipil - ITB

DOI:

https://doi.org/10.5614/jts.2006.13.4.3

Keywords:

Interface, Lapisan tipis, SAP2000, CIRCLY 4, Bonding stiffness.

Abstract

Abstrak. Untuk membantu analisis backcalculation yang melibatkan faktor bonding antar lapis perkerasan beraspal, perlu diketahui kondisi daya lekat (bonding) interface yang dimodelkan sebagai lapisan tipis (thin layer). Lapisan tipis ini tentunya mempunyai modulus kekakuan (stiffness modulus) yang mempunyai rentang tertentu sesuai kondisi daya lekatnya (bonding). Penelitian ini bertujuan untuk mengetahui rentang modulus tersebut dengan pendekatan analitis yang dibantu dengan program komputer SAP2000. Dengan memasukkan nilai modulus thin layer yang bervariasi mulai 1 MPa sampai dengan 10000 MPa, lendutan yang terjadi akibat beban tertentu kemudian dihitung dengan program SAP2000. Dengan program CIRCLY didapat lendutan pada kondisi interface rough dan smooth sebagai referensi dalam menentukan batas-batas kondisi Rough dan Smooth pada lendutan yang dihasilkan SAP2000. Nilai rentang modulus ini adalah lendutan yang dihitung pada batas kondisi daya lekat (bonding) yang kuat dengan thin layer modulus sebesar 50 MPa dan bonding yang lemah (smooth) dengan thin layer modulus sebesar 1.6 MPa

Abstract. In order to support back calculation analysis which involved bonding factor between bituminous pavement layer, information of bonding condition at the interface is required which can be modeled as a thin layer. This thin layer has a stiffness modulus with a certain range of modulus related to its bonding condition. The objective of this research is to determine the range modulus with analytical approach using SAP2000 software. Involving various thin layer modulus starting from 1 MPa until 10000 MPa yield deflection values due to certain pavement loading using SAP2000. Using CIRCLY Program obtained the deflection in rough and smooth condition as reference to determining rough and smooth condition in deflection calculation using SAP2000. These range of modulus are deflection values which are calculated on rough condition with thin layer modulus 50 MPa and on smooth condition with thin layer modulus 1.6 MPa.

References

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Published

2010-12-01

How to Cite

Hariyadi, E. S. (2010). Rentang Modulus dari Thin Layer yang Menunjukkan Kondisi Bonding Antar Lapisan Beraspal. Jurnal Teknik Sipil, 13(4), 177-182. https://doi.org/10.5614/jts.2006.13.4.3

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Articles